Israel Beinglass: search on Z-Library

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1

Integrated system for deposition of polysilicon and WSix films

Israel Beinglass, Ashok K. Sinha

Journal:

Microelectronic Engineering

Year:

1994

Language:

english

File:

PDF, 517 KB

english, 1994

2

CVD Al/PVD Al integration for advanced via and interconnect technology

Israel Beinglass, Mehul Naik

Journal:

Thin Solid Films

Year:

1998

Language:

english

File:

PDF, 2.60 MB

english, 1998

3

[IEEE 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Rohnert Park, CA, USA (2015.10.5-2015.10.8)] 2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Modified ELTRAN® — A game changer for Monolithic 3D

Or-Bach, Zvi, Cronquist, Brian, Wurman, Zeev, Beinglass, Israel, Henning, Albert K.

Year:

2015

File:

PDF, 548 KB

2015

4

[IEEE 2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Millbrae, CA, USA (2014.10.6-2014.10.9)] 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Precision bonders - A game changer for monolithic 3D

Or-Bach, Zvi, Cronquist, Brian, Wurman, Zeev, Beinglass, Israel, Henning, Albert

Year:

2014

Language:

english

File:

PDF, 952 KB

english, 2014

5

Morphology and Step Coverage of In-Situ Doped Polysilicon Films Deposited by Single Wafer CVD

Fitch, Jon T., Hegde, Rama I., Beinglass, Israel, Venkatesan, Mali

Journal:

MRS Proceedings

Year:

1994

Language:

english

File:

PDF, 1.20 MB

english, 1994

6

SPIE Proceedings [SPIE Design, Process Integration, and Characterization for Microelectronics - Santa Clara, CA (Wednesday 6 March 2002)] Design, Process Integration, and Characterization for Microelectronics - Meeting the challenges of process module and fab-wide active control for 300 mm, 130 nm, and beyond

Beinglass, Israel, Starikov, Alexander, Tobin, Jr., Kenneth W.

Year:

2002

Language:

english

File:

PDF, 497 KB

english, 2002